Dies are specialized machine tools used in the automotive industry to press sheets of metal into shapes (e.g. car doors). Die spotting is a process for refining these tools during development – so named because of a blue paste that colours the metal and forms spots of lesser blue colour to show where the tool must be optimized. Die spotting
3D printing has revolutionized manufacturing. Printing metals, however, is not a simple as printing plastics. Metal printing requires the use of powder which is hazardous and requires special equipment to handle. Instead of powder, this technology uses a wire-feedstock, made possible through improved welding technology that can match the precision of powder-based printers.
Collaborative robots (Cobots) are being used more and more frequently in electronics manufacturing. These robots are, however, designed to perform one specific task at a time, with task-switching only possible by changing the robot’s manipulator manually. This tool holder enables a Cobot to pick up and use tools without assistance, enabling multiple tasks to be performed via an automated setup.
Tracking construction progress is a vital task. When performed manually, it is inefficient, and the risk for mistakes and delays in the project increases. This technology automates construction site monitoring with smart 3D-scanning helmets and software that, together, generate a 3D model that can be continuously compared with the original design.
Crystallography is a chemistry technique for characterizing compounds. Standard crystallography uses X-ray technology, but this is limited because crystals must be a certain size. Only about a third of crystalline compounds make large crystals. Alternatively, transmission electron microscopes can be used for the same technique. Here, there is no lower size limitation, but these machines are designed for imaging, not
Electrodeposition is the process of coating surfaces using electrochemical reactions, for example to prevent corrosion, improve aesthetics, or create an electronically conductive surface. Current standard methods for electrodeposition are resource-intensive and costly. This technology solves these problems, enabling nanoscale-thin electrodeposition on a variety of surfaces.
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